Leadframe panel

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7714418
APP PUB NO 20090026590A1
SERIAL NO

11781788

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced.

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Patent Owner(s)

  • NATIONAL SEMICONDUCTOR CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lim, Peng Soon Melaka, MY 12 120
Pham, Ken San Jose, US 38 422
Yii, Terh Kuen Melaka, MY 6 103
Zin, Mohd Sabri Bin Mohamad Melaka, MY 2 61

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