Method for manufacturing light emitting diode filament

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11199298
APP PUB NO 20210172573A1
SERIAL NO

16744112

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Abstract

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The present application discloses a method for manufacturing an LED filament, which includes: operation , a plurality of metal sheets are provided and arranged at least two rows in parallel; operation S2, a plurality of brackets are provided, and each bracket is located between two corresponding metal sheets and fixedly connected to the two metal sheets; operation S3, a plurality of LED chips are provided and attached to each of the brackets, and the LED chips are electrically connected to the metal sheets by conducting wire; operation S4, each bracket, the LED chips defined on the bracket, the conducting wire defined on the bracket, and the joints of the bracket and the metal sheets are all cladded using packaging material to form an encapsulation layer, and the encapsulation layer, the bracket, the LED chips, the conducting wire, and the connected two metal sheets cooperatively form an LED filament.

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Patent Owner(s)

  • ZHONGSHAN MLS ELECTRONIC CO., LTD

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Sheng Zhongshan, CN 83 894
Liu, Jiwei Zhongshan, CN 3 0
Meng, Ji-An Zhongshan, CN 2 2
Shi, Hongli Zhongshan, CN 5 0
Yang, Yu Zhongshan, CN 419 2827
Yao, Qinglin Zhongshan, CN 1 0

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