Heat-rejecting media for use in dual-printed circuit board device

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United States of America Patent

PATENT NO 11589479
SERIAL NO

17487398

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Abstract

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Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.

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Patent Owner(s)

  • DELL PRODUCTS L.P.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Li, Zhaobo Shanghai, CN 2 1
Shang, Zhaowei Shanghai, CN 1 0
Zhang, Mingming Shanghai, CN 53 219

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