Electroplating compositions and methods
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United States of America Patent
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Dec 19, 2006
Issued Date -
N/A
app pub date -
Apr 2, 2004
filing date -
Apr 7, 2003
priority date (Note) -
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Abstract
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
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