Semiconductor device with fuse box and method for fabricating the same

United States of America Patent

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Jan 3, 2006
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Jan 4, 2005
filing date
Apr 4, 2002

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Expired

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Abstract

A semiconductor device comprises a semiconductor substrate having a bonding pad region; and a bonding pad and a fuse box formed in the bonding pad region. Thus, the chip size can be reduced and the manufacturing yield can be increased.

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Patent Owner(s)

SAMSUNG ELECTRONICS CO., LTD.

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kim, Hyun-Chul	Seoul, KR	121	638

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Semiconductor device with fuse box and method for fabricating the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11029830

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US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 03, 2006	US,6982219,B2 US6982219B2	GRANTED PATENT AS SECOND PUBLICATION
June 02, 2005	US,20050116316,A1 US20050116316A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	6982219
SERIAL NO	11029830
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11029830

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