Method to improve CMP scratch resistance for non planar surfaces

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United States of America Patent

PATENT NO 10090264
APP PUB NO 20170162526A1
SERIAL NO

15434406

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A microelectronic device is formed by providing a substrate having a recess at a top surface, and a liner layer formed over the top surface of the substrate, extending into the recess. A protective layer is formed over the liner layer, extending into the recess. A CMP process removes the protective layer and the liner layer from over the top surface of the substrate, leaving the protective layer and the liner layer in the recess. The protective layer is subsequently removed from the recess, leaving the liner layer in the recess. The substrate may include an interconnect region with a bond pad and a PO layer having an opening which forms the recess; the bond pad is exposed in the recess. The liner layer in the recess may be a metal liner suitable for a subsequently-formed wire bond or bump bond.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burnett, Andrew Frank Plano, US 4 2
Davis, Jonathan Philip Allen, US 14 54
Zinn, Brian Edward Lucas, US 3 2

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