Lead on chip semiconductor device and method of fabricating the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Oct 24, 2000
Grant Date -
N/A
app pub date -
Feb 26, 1999
filing date -
Feb 27, 1998
priority date (Note) -
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Abstract
The present invention provides a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the busbar lead is depressed toward a major surface of a semiconductor chip to form a depressed portion, and the depressed portion is bonded to the major surface of the semiconductor chip by an adhesive layer. The signal lead and the busbar lead are spaced apart from the major surface of the semiconductor chip.
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