Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
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United States of America Patent
Stats
-
Nov 2, 2004
Grant Date -
Jun 5, 2003
app pub date -
Nov 30, 2001
filing date -
Nov 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microelectronic device and methods of fabricating the same comprising a microelectronic die having an active surface, a back surface, and at least one side. The microelectronic die side comprises a trench sidewall, a lip and a channel sidewall. A metallization layer is disposed on the microelectronic die back surface and the trench sidewall.
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