Bonding of composite materials

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United States of America Patent

PATENT NO 9789646
SERIAL NO

14923972

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Abstract

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A method for surface preparation of composite substrates prior to adhesive bonding. A curable surface treatment layer is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the surface treatment layer remains partially cured. The surface treatment layer may be a resin film or a removal peel ply composed of resin-impregnated fabric. After surface preparation, the composite substrate is provided with a chemically-active, bondable surface that can be adhesively bonded to another composite substrate to form a covalently-bonded structure.

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Patent Owner(s)

  • CYTEC INDUSTRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kohli, Dalip Churchville, US 7 75
MacAdams, Leonard Woolwich Township, US 11 38

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