FinFET device having a source/drain region with a multi-sloped undersurface

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United States of America Patent

PATENT NO 11527650
APP PUB NO 20210135000A1
SERIAL NO

16991149

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Abstract

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A device includes a first fin and a second fin extending from a substrate, the first fin including a first recess and the second fin including a second recess, an isolation region surrounding the first fin and surrounding the second fin, a gate stack over the first fin and the second fin, and a source/drain region in the first recess and in the second recess, the source/drain region adjacent the gate stack, wherein the source/drain region includes a bottom surface extending from the first fin to the second fin, wherein a first portion of the bottom surface that is below a first height above the isolation region has a first slope, and wherein a second portion of the bottom surface that is above the first height has a second slope that is greater than the first slope.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Wei-Min Tainan, TW 46 337
Su, Li-Li Chubei, TW 56 77
Yeo, Yee-Chia Hsinchu, TW 430 6723

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