Chip structure and method for forming the same

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United States of America Patent

PATENT NO 11848270
SERIAL NO

16422988

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Abstract

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A chip structure is provided. The chip structure includes a substrate. The chip structure includes a redistribution layer over the substrate. The chip structure includes a bonding pad over the redistribution layer. The chip structure includes a shielding pad over the redistribution layer and surrounding the bonding pad. The chip structure includes an insulating layer over the redistribution layer and the shielding pad. The chip structure includes a bump over the bonding pad and the insulating layer. A sidewall of the bump is over the shielding pad.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Kuo-Chin Chiayi, TW 46 448
Hsu, Kuo-Ching New Taipei, TW 71 1914
Lii, Mirng-Ji Sinpu Township, Hsinchu County, TW 243 5701
Shue, Hong-Seng Zhubei, TW 30 92
Tsai, Sheng-Han Hsinchu, TW 6 9

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