Electrically conductive substrate with high heat conductivity
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United States of America Patent
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Feb 2, 2010
Grant Date -
Oct 16, 2008
app pub date -
Apr 11, 2007
filing date -
Apr 11, 2007
priority date (Note) -
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Abstract
An electrically conductive substrate with a high heat conductivity has an aluminum plate having multiple holes. An isolation layer is formed on the aluminum plate and inner walls of the holes. Multiple electrically conductive materials are inserted in the holes. A circuit layer is formed on the aluminum plate, electrically connects to the electrically conductive materials and has a rough surface. A graphite layer is formed on the rough surface of the circuit layer. The electric components are respectively provided on the holes, and the heat generated by the electric components is dissipated effectively by the aluminum plate.
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