Semiconductor device having a built-in heat sink and process of manufacturing same
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United States of America Patent
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May 22, 2001
Grant Date -
N/A
app pub date -
Sep 3, 1998
filing date -
Sep 3, 1998
priority date (Note) -
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Abstract
The present invention provides a semiconductor device assembly comprising a semiconductor chip, a heat sink having internal and external portions, and a housing that encapsulates the semiconductor chip and the internal portion. The internal portion thermally couples to one surface of the semiconductor chip. The present invention also provides a process of fabricating a semiconductor device assembly. The process includes: providing a semiconductor chip; providing a heat sink having internal and external portions; mechanically attaching a face of the chip to the internal portion; and applying an encapsulating material around the semiconductor chip and the internal portions.
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