Semiconductor package structure

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United States of America Patent

PATENT NO 11908767
APP PUB NO 20220223491A1
SERIAL NO

17545015

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Abstract

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A semiconductor package structure includes a first redistribution layer, a semiconductor die, a thermal spreader, and a molding material. The semiconductor die is disposed over the first redistribution layer. The thermal spreader is disposed over the semiconductor die. The molding material surrounds the semiconductor die and the thermal spreader.

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Patent Owner(s)

Patent OwnerAddress
MEDIATEK INCHSIN-CHU 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Chia-Hao Hsinchu, TW 111 564
Kuo, Che-Hung Hsinchu, TW 26 90
Liu, Hsing-Chih Hsinchu, TW 25 54

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