Chip package and method for manufacturing the same
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United States of America Patent
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Sep 16, 2003
Issued Date -
N/A
app pub date -
Oct 23, 2002
filing date -
Feb 16, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.
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