Method for manufacturing printing plate
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United States of America Patent
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-
Nov 4, 2008
Grant Date -
Mar 1, 2007
app pub date -
May 2, 2006
filing date -
Aug 29, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for manufacturing a printing plate to acheive a precise and fine pattern by minimizing a variation of etching critical dimension is disclosed. The method uses a hard mask having an opening on an insulating substrate to form a first trench having a first depth in the insulating substrate. A first etching stopper and a first photoresist may be applied on a surface of the insulating substrate including the first trench for patterning the first photoresist by exposing the first photoresist. Likewise, a second and third trench may be formed.
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