Laser soldering of flexible leads
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United States of America Patent
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-
Oct 8, 1991
Grant Date -
N/A
app pub date -
Oct 1, 1990
filing date -
Oct 1, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for soldering a lead to a pad having a solder plate formed thereon is described. In one embodiment of the method, a tape is disposed between the lead and a laser source, and the method includes the steps of aligning the lead with the solder plated pad, transmitting a beam from the laser source through the tape and to a location where a solder joint is to be formed, and the beam heating the solder plate thereby causing reflow of the solder plate to form a solder joint.
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