Method and apparatus of eddy current monitoring for chemical mechanical polishing
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United States of America Patent
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Feb 21, 2006
Grant Date -
Aug 7, 2003
app pub date -
Apr 16, 2002
filing date -
Feb 6, 2002
priority date (Note) -
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Abstract
A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
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