Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts
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United States of America Patent
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Sep 18, 2007
Grant Date -
Apr 27, 2006
app pub date -
Oct 21, 2004
filing date -
Oct 21, 2004
priority date (Note) -
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Abstract
A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.
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