Electronic part
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United States of America Patent
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-
Nov 9, 2004
Grant Date -
Aug 28, 2003
app pub date -
Apr 22, 2003
filing date -
Jan 30, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm.sup.2 /g.
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