Transport apparatus for thin, board-shaped substrates
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United States of America Patent
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-
Sep 5, 2000
Grant Date -
N/A
app pub date -
Mar 5, 1998
filing date -
Mar 5, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is directed to a transport apparatus for thin, board-shaped substrates, for example printed circuit boards, which are conveyed through a coating installation and the like. In order to simplify manipulation during conveying, there is provided a frame (1) for holding a substrate (7), tensioning elements (4) being arranged spaced from one another on frame members (2), lying opposite one another, of the frame (1), which tensioning elements (4) engage the edge of the substrate and tension the substrate, the frame (1) being provided with a device (16) which serves to provide connection to a conveyor belt or the like. The tension springs (4) exert a tension away from the substrate (7) in the direction of the plane of the thin substrate to avoid sagging of the substrate. FIG. (1) illustrates the transport apparatus.
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