Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device

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Jan 11, 2011
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Dec 29, 2006
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Sep 15, 2006

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MITSUBISHI ELECTRIC CORPORATION

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Hori, Yukitaka	Fukuoka, JP	4	9

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Semiconductor device manufacturing method, semiconductor wafer, and semiconductor device

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United States of America Patent

11618038

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US Family Size	Non-US Coverage
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DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 11, 2011	US,7867829,B2 US7867829B2	GRANTED PATENT AS SECOND PUBLICATION
March 20, 2008	US,20080070347,A1 US20080070347A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	7867829
SERIAL NO	11618038
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11618038

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