Integrated circuit having conductive paths of different heights formed from the same layer structure and method for forming the same
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United States of America Patent
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May 28, 2002
Issued Date -
N/A
app pub date -
Feb 15, 2000
filing date -
Sep 12, 1997
priority date (Note) -
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Abstract
An integrated circuit includes a substrate having a surface. A first conductive path is disposed on the substrate at a first level and has a first height. A second conductive path is also disposed on the substrate at the first level and has a second height that is significantly different than the first height. Where the integrated circuit is a memory circuit, the digit lines formed from a layer can have a smaller height than other signal lines that are formed from the same layer. Thus, the capacitive coupling between the digit lines can be reduced without degrading the current carrying capability of the other signal lines.
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