Package-type piezoelectric resonator and method of manufacturing package-type piezoelectric resonator
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United States of America Patent
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May 15, 2012
Grant Date -
May 13, 2010
app pub date -
Feb 19, 2008
filing date -
Feb 20, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided is a package-type piezoelectric sensor which can be packaged at a wafer stage and which is suitable for mass production. A package-type quartz resonator has lead electrodes that are interposed in a close contact state, between on one side stepped surfaces, and on another side a lower surface of a frame portion of a piezoelectric substrate. The close contact state is maintained when a base is joined to a lower surface side of the piezoelectric substrate. By joining a cover to an upper surface side of the piezoelectric substrate and joining the base to the lower surface side of the piezoelectric substrate, the piezoelectric substrate may be easily sealed to be airtight. In particular, a space in a recessed portion of the base is sealed airtight. This enables avoidance of complications in the manufacturing process.
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