LED lighting devices

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United States of America Patent

PATENT NO 10158057
APP PUB NO 20130175558A1
SERIAL NO

13828297

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Abstract

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Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths.

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Patent Owner(s)

  • CORNING INCORPORATED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Borrelli, Nicholas Francis Elmira, US 116 1223
Lamberson, Lisa Ann Painted Post, US 36 753
Morena, Robert Michael Lindley, US 106 2214
Orsley, Timothy James San Jose, US 41 1017
Trutna, William Richard Atherton, US 13 256

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