Methods and apparatus for wet cleaning electrode assemblies for plasma processing apparatuses
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United States of America Patent
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May 17, 2011
Grant Date -
Apr 24, 2008
app pub date -
Dec 19, 2006
filing date -
Oct 16, 2006
priority date (Note) -
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Abstract
A method for cleaning an electrode assembly comprising a backing plate bonded to an electrode plate for a plasma processing assembly, the method including the steps of contacting the backing plate and electrode plate with a solvent; spraying the backing plate and electrode plate with water; ultrasonically cleaning the electrode assembly; enclosing the electrode assembly in a flushing fixture defined by a base plate having a plurality of liquid passages and a cover plate configured to cover the base plate, the cover plate including at least one liquid passage; and flushing the electrode assembly in the flushing fixture by introducing a flushing liquid under pressure through said at least one liquid passage in the cover plate.
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