Copper alloy material, electrical or electronic parts, and method of producing a copper alloy material
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United States of America Patent
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Aug 5, 2014
Grant Date -
Aug 11, 2011
app pub date -
Apr 21, 2011
filing date -
Oct 22, 2008
priority date (Note) -
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Abstract
A copper alloy material, having an alloy composition containing any one or both of Ni and Co in an amount of 0.4 to 5.0 mass % in total, and Si in an amount of 0.1 to 1.5 mass %, with the balance being copper and unavoidable impurities, wherein a ratio of an area of grains in which an angle of orientation deviated from S-orientation {2 3 1}<3 4 6> is within 30° is 60 % or more, according to a crystal orientation analysis in EBSD measurement; an electrical or electronic part formed by working the copper alloy material; and a method of producing the copper alloy material.
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