Cooling device with a preformed compliant interface
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United States of America Patent
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Jan 12, 2010
Grant Date -
Jan 29, 2009
app pub date -
Jul 23, 2007
filing date -
Jul 23, 2007
priority date (Note) -
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Abstract
An integrated circuit package includes: a substrate; an electronic circuit located on the substrate, the electronic circuit comprising a topography of at least one level; a cooling device located over the electronic circuit; a compliant interface disposed between the electronic circuit and the cooling device, wherein the compliant interface comprises a first surface and a second surface and wherein the first surface is in thermal contact with the electronic circuit, and wherein the compliant interface is preformed from a compliant material such that the first surface substantially conforms to the topography of the electronic circuit.
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