Flip chip type saw band reject filter design
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United States of America Patent
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Aug 9, 2016
Grant Date -
Feb 25, 2016
app pub date -
Nov 5, 2015
filing date -
Feb 6, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A method and system for providing a surface acoustic wave band reject filter are disclosed. According to one aspect, a surface acoustic wave band reject filter includes a substrate having electrode bars and bonding pads formed on the substrate. The filter further includes at least one die having a side facing the substrate. A plurality of surface acoustic wave resonators are formed on the at least one die formed on the substrate. Solder balls formed on a side of the at least one die facing the substrate are positioned to engage bonding pads on the substrate. The plurality of surface acoustic wave resonators collectively exhibit a band reject filter response.
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