Method of manufacturing wiring substrate
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United States of America Patent
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Aug 16, 2016
Grant Date -
Feb 12, 2015
app pub date -
Jul 30, 2014
filing date -
Aug 9, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each core substrates; adhering an electronic component to the film in the cavity of each of the core substrates; arranging a support between the core substrates and a first insulator between the support and the core substrates; stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates, the cavities are filled with the first insulators, and the first insulators fix the corresponding electronic components to the corresponding core substrates; removing the film from the core substrates; and separating the core substrates from the support to separate the core substrates from each other.
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