Process for producing substrate for flexible circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 6, 2007
Grant Date -
Jul 14, 2005
app pub date -
Dec 8, 2004
filing date -
Dec 10, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the multilayered insulating resin layer via the adhesive layer at a temperature not lower than the glass transition temperature of the insulating layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully