Three dimensional antenna array module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11901635
APP PUB NO 20220416442A1
SERIAL NO

17898706

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

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Patent Owner(s)

  • MOVANDI CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Besoli, Alfred Grau Irvine, US 64 522
Boers, Michael South Turramurra, AU 114 1146
De, Flaviis Franco Irvine, US 36 567
Gharavi, Sam Irvine, US 103 842
Rofougaran, Ahmadreza Newport Beach, US 628 10227
Rofougaran, Maryam Rancho Palos Verdes, US 418 9236
Shin, Donghyup Irvine, US 40 343
Shirinfar, Farid Granada Hills, US 97 826
Sridharan, Kartik San Diego, US 52 365
Wu, Stephen Fountain Valley, US 121 1386
Yoon, Seunghwan Irvine, US 158 1517

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