Semiconductor device having conductive patterns with mesh pattern and differential signal wirings

Number of patents in Portfolio can not be more than 2000

United States of America

PATENT NO 11990397
APP PUB NO 20230187330A1
SERIAL NO

18163617

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device comprising a wiring member with which a semiconductor chip is electrically connected including: a first wiring layer having a plurality of first conductive patterns; a second wiring layer arranged next to the first wiring layer in a thickness direction of the wiring member, and having a second conductive pattern; and a third wiring layer arranged next to the second wiring layer in the thickness direction of the wiring member, and having a third conductive pattern. Here, in plan view, a first opening portion of each of two, which are arranged next to each other, of a plurality of first opening portions each penetrating through the second conductive pattern is overlapped with a pair of differential signal wirings contained in plurality of first conductive patterns, and is overlapped with two or more of a plurality of second opening portions each penetrating through the third conductive pattern.

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Patent Owner(s)

  • RENESAS ELECTRONICS CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kariyazaki, Shuuichi Tokyo, JP 38 419
Shiroi, Wataru Tokyo, JP 10 19

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