Organopolysiloxane composition for electrical insulation
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United States of America Patent
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Dec 29, 1998
Grant Date -
N/A
app pub date -
Aug 30, 1996
filing date -
Sep 1, 1995
priority date (Note) -
Expired
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Abstract
There is provided an organopolysiloxane composition for electrical insulation wherein the fluidity is good and an inorganic filler deposited on the bottom of a vessel during the storage can be easily and simply redispersed. The unfoamable organopolysiloxane composition for electrical insulation comprises (A) an organopolysiloxane containing at least two alkenyl groups each bonded to a silicon atom in the molecule, (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms each bonded to a silicon atom in the molecule, (C) an organopolysiloxane containing at least one hydroxyl group bonded to a silicon atom in the molecule, (D) an inorganic filler having an average particle diameter of 1 to 50 .mu.m, and (E) platinum or a platinum compound.
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