Conductive material for integrated circuit fabrication
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United States of America Patent
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-
Feb 11, 2003
Grant Date -
Nov 22, 2001
app pub date -
Mar 23, 2001
filing date -
Apr 6, 1999
priority date (Note) -
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Abstract
A conductive composition of titanium boronitride (TiB.sub.x N.sub.y) is disclosed for use as a conductive material. The titanium boronitride is used as conductive material in the testing and fabrication of integrated circuits. For example, the titanium boronitride is used to construct contact pads such as inline pads, backend pads, sensors or probes. Advantages of embodiments of the titanium boronitride include reduced scratching, increased hardness, finer granularity, thermal stability, good adhesion, and low bulk resistivity. Exemplary methods of creating the titanium boronitride include a sputtering process and a plasma anneal process.
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