Multilayer electronic part, its manufacturing method, two-dimensionally arrayed element packaging structure, and its manufacturing method
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United States of America Patent
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Sep 28, 2004
Grant Date -
N/A
app pub date -
Apr 24, 2001
filing date -
Oct 29, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In order to provide a two-dimensionally arrayed probe (element packaging structure) in which a multilayer element can be used as a piezoelectric ceramic transducer element, each defective element can be replaced and the ill connection of each element can be repaired, and in order to provide a multilayer electric part suitable for realizing such an element packaging structure, the multilayer electronic part is configured with a multilayer chip-like element having a surface electrode, an internal electrode and a back electrode on the one hand and a flexible board attached to one side surface of the chip-like element on the other hand, alternate ones of the electrodes along the multilayer of the chip-like element are connected electrically to each other by the electrode pattern of the flexible board thereby to form two electrode groups, and the end portions of the electrode pattern of the flexible board are used as the two electrode portions for external connection which are electrically connected to the two electrode groups.
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