Semiconductor assembly with a semiconductor module
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United States of America Patent
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-
Aug 10, 2004
Grant Date -
Oct 16, 2003
app pub date -
Apr 16, 2003
filing date -
Apr 16, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor assembly includes a module holder and a semiconductor module, which has a board substrate with conductor tracks and one or more unpackaged semiconductor chips mounted on the substrate, which are connected to conductor tracks on the substrate by electrical contacts. The substrate has at one edge at least one contact strip with connection contact areas, which are connected to at least some of the conductor tracks. The module holder has a plug-in connection for the electrical connection to other components, at least one mating contact strip for the connection to the contact strip of the at least one semiconductor module and electrical conductors between the contact areas of the at least one semiconductor module and electrical contacts of the plug-in connection. The configuration allows semiconductor modules to be connected to the outside world in an economical way.
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