Melt-based patterning for electronic devices
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United States of America Patent
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Oct 16, 2007
Grant Date -
Jan 13, 2005
app pub date -
May 24, 2004
filing date -
Jun 3, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides methods and apparatus for melt-based patterning for electronic devices. It employs and provides processes and apparatus for fabricating an electronic device having a pattern formed on a surface by a deposition material. Further, the invention a process for fabricating semiconductors, organic light-emitting devices (OLEDs), field-effect transistors, and in particular high-resolution patterning for RGB displays. A process for fabricating an organic electronic device includes the steps of heating and applying a pressure to the deposition material to form a melt, and depositing the melted deposition material on the surface with a phase-change printing technique or a spray technique. The melted deposition material solidifies on the surface.
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