Interface circuit, chip containing interface circuit and manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11140777
APP PUB NO 20210037643A1
SERIAL NO

16076626

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed is an interface circuit, a chip containing an interface circuit and a manufacturing method thereof. The interface circuit includes an I/O processing sub-circuit, a path selection sub-circuit, and at least two I/O ports. The I/O processing sub-circuit, the path selection sub-circuit, and the at least two I/O ports are electrically connected in sequence. The path selected by the path selection sub-circuit can enable a first and a second electrical signal to be transmitted through the I/O ports that are configured to correspond to the ports of the external device through which the first and second electrical signals are transmitted. That is, the path selection sub-circuit can customize the layout of the signal-input/output I/O ports of the interface circuit according to the layout of the ports of the external device.

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Patent Owner(s)

  • SHENZHEN SANDIYIXIN ELECTRONIC CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Xiangbing Shenzhen, CN 1 0

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