Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
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United States of America Patent
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Jul 10, 2007
Grant Date -
Oct 20, 2005
app pub date -
Apr 14, 2005
filing date -
Apr 20, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor module has metallic radiator plates provided at central regions of principal surfaces of a sealing resin so as to expose from these principal surfaces. The metallic radiator plates and the principal surfaces of the sealing resin are bonded via grease gaps to heat receiving members. The grease gaps are widened in outer regions far from the metallic radiator plates compared with inner regions adjacent to the metallic radiator plates, to prevent external air from entering into the grease gaps even when the semiconductor module causes repetitive thermal expansions and contractions.
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