Wired circuit board
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United States of America Patent
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-
Dec 16, 2008
Grant Date -
Oct 25, 2007
app pub date -
Apr 20, 2007
filing date -
Apr 20, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed on the metal supporting board to be in contact with the metal supporting board and the semiconductive layer.
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