Forming method of flip-chip light emitting diode structure

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United States of America Patent

PATENT NO 11811001
APP PUB NO 20230078065A1
SERIAL NO

18051019

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The forming method of a flip-chip light emitting diode structure includes the following steps. A first substrate including a first semiconductor layer, an active layer on the first semiconductor layer and a second semiconductor layer on the active layer is provided. A first current blocking layer is formed on the second semiconductor layer, in which the first current blocking layer has a plurality of interspaces. A reflective layer covering the interspaces is formed, in which the reflective layer has a plurality of recesses, and each of the recesses is corresponding to each of the interspaces. A second current blocking layer filling into the recesses is formed.

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Patent Owner(s)

  • LEXTAR ELECTRONICS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jih-Kang Hsinchu, TW 7 0
Yang, Shih-Wei Hsinchu, TW 23 506

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