Adjusting the damping level of an encapsulated device
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United States of America Patent
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Jun 28, 2011
Grant Date -
Apr 15, 2010
app pub date -
Oct 13, 2008
filing date -
Oct 13, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
Encapsulated devices that can adjust the damping level within are provided. In this regard, a representative encapsulated device, among others, comprises a bottom substrate, a middle substrate that is disposed above the bottom substrate, and a top substrate that is disposed above the middle substrate. The middle substrate comprises an outermost structure and at least one damping device. The at least one damping device is supported to the outermost structure. At least one top gap and a bottom gap are formed between the at least one damping device and the top and bottom substrates, respectively. The at least one top gap has at least one cavity depth that is adapted to adjust the damping level of the encapsulated device.
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