Apparatus and method for embedding components in small-form-factor, system-on-packages

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9225379
APP PUB NO 20140342679A1
SERIAL NO

14448151

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

According to various aspects of the present disclosure, devices and methods are disclosed that include communication platform including a small form factor platform having a system-on-package architecture. The system-on-package architecture may be arranged as a stack of layers including: a first layer of the stack of layers having a first conformable material; a second layer of the stack of layers having a second conformable material; a third layer of the stack of layers having a third material, wherein the first conformable material and the second conformable material are more flexible than the third material; and one or more electronic components embedded within the stack of layers, wherein the one or more electronic components are configured to process a received wireless signal.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alluri, Prasad El Dorado Hills, US 8 107
Choudhury, Debabani Thousand Oaks, US 53 1737

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jun 29, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00