Package structure for light emitting diode and method thereof
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United States of America Patent
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-
Apr 18, 2006
Grant Date -
May 27, 2004
app pub date -
Nov 19, 2003
filing date -
Nov 21, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package structure for a light emitting diode (LED) includes a substrate structure and a reflective layer. The substrate structure sequentially includes a conduction board, an insulation layer, and a conductive layer. The substrate structure has an opening to expose the conduction board. The reflective layer configured to support and electrically couple to a first electrode of the LED is disposed in the opening. The reflective layer is electrically coupled to the conduction board and electrically insulated from at least a portion of the conductivity layer, which is coupled to a second electrode of the LED.
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