Anadization system with remote voltage sensing and active feedback control capabilities
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United States of America Patent
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-
Jan 2, 1990
Grant Date -
N/A
app pub date -
Aug 23, 1988
filing date -
Aug 23, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The disclosure relates to a process station to precisely control the electrochemical anodization of specially prepared silicon substrates. Remotely placed voltage probes are utilized to monitor changes in the potential drop across the wafer as the anodization proceeds. As the available anodilizable area changes, the voltage drop across the wafer and hence the anodization current density is maintained at the desired value by the computer through the use of active feedback provided by these probes. Any desired anodization conditions can be programmed into the system using the system software, thereby adding an even greater degree of control over the process.
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