Reliable through-silicon vias

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11682465
APP PUB NO 20230102669A1
SERIAL NO

17491164

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Abstract

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An integrated circuit includes a TSV extending from a first surface of a semiconductor substrate to a second surface of the semiconductor substrate and having a first end and a second end, and a non-volatile repair circuit. The non-volatile repair circuit includes a one-time programmable (OTP) element having a programming terminal, wherein in response to an application of a fuse voltage to the programming terminal, the OTP element electrically couples the first end of the TSV to the second end of the TSV.

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Patent Owner(s)

  • ATI TECHNOLOGIES ULC

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gong, Zheng Toronto, CA 29 84
Wang, Jiao Markham, CA 69 384
Yang, Zhenhua Markham, CA 10 94

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