Semiconductor device

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United States of America Patent

PATENT NO 6538319
SERIAL NO

09777676

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device including a substrate having a surface on which interconnections are formed, a semiconductor element connected to the interconnections and mounted on the substrate, and a conductive cap for covering the semiconductor element electrically connected to a ground potential. The emission of an electromagnetic wave from the semiconductor element externally of the semiconductor device and malfunctioning of the semiconductor element due to an external electromagnetic wave incident thereon, can be prevented by the conductive cap.

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Patent Owner(s)

  • HPLP TECHNOLOGIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Terui, Makoto Tokyo, JP 87 987

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