Embedding sensors in 3D-printed silicon carbide
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United States of America
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Apr 23, 2024
Grant Date -
Jul 29, 2021
app pub date -
Jan 6, 2021
filing date -
Jan 6, 2021
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Abstract
An improved method for embedding one or more sensors in SiC is provided. The method includes depositing a binder onto successive layers of a SiC powder feedstock to produce a dimensionally stable green body have a true-sized cavity. A sensor component is then press-fit into the true-sized cavity. Alternatively, the green body is printed around the sensor component. The assembly (the green body and the sensor component) is heated within a chemical vapor infiltration (CVI) chamber for debinding, and a precursor gas is introduced for densifying the SiC matrix material. During infiltration, the sensor component becomes bonded to the densified SiC matrix, the sensor component being selected to be thermodynamically compatible with CVI byproducts at elevated temperatures, including temperatures in excess of 1000° C.
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- 15 United States
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Patent Owner(s)
- UT-BATTELLE, LLC
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- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Jolly, Brian C | Oak Ridge, US | 3 | 3 |
Petrie, Christian M | Oak Ridge, US | 7 | 0 |
Terrani, Kurt A | Oak Ridge, US | 7 | 6 |
Trammell, Michael P | Oak Ridge, US | 7 | 60 |
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