Thermally conductive grease composition and semiconductor device using the same
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United States of America Patent
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Apr 16, 2002
Grant Date -
Feb 14, 2002
app pub date -
May 26, 1999
filing date -
Aug 21, 1998
priority date (Note) -
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Abstract
A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 .mu.m; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 .mu.m and coarse metallic aluminum powder having an average particle size of 10 to 40 .mu.m; and a semiconductor device utilizing the aforesaid grease composition.
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